SGLS390G July   2009  – November 2015 CDCM7005-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Automatic/Manual Reference Clock Switching
      2. 9.3.2 PLL Lock for Analog and Digital Detect
        1. 9.3.2.1 PLL Lock/Out-of-Lock Definition
        2. 9.3.2.2 Digital vs Analog Lock
      3. 9.3.3 Differential LVPECL Outputs and Single-Ended LVCMOS Outputs
      4. 9.3.4 Frequency Hold-Over Mode
      5. 9.3.5 Charge Pump Preset to VCC_CP / 2
      6. 9.3.6 Charge Pump Current Direction
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 SPI Control Interface
      2. 9.5.2 Functional Description of the Logic
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Clock Generation for Interpolating DACs With the CDCM7005-SP
        1. 10.1.1.1 AC-Coupled Interface to ADC/DAC
      2. 10.1.2 Phase Noise Performance
        1. 10.1.2.1 In-Band Noise Performance
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • HFG|52
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 Device and Documentation Support

13.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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