ZHCS757A February 2012 – April 2016 CDCM9102
PRODUCTION DATA.
The CDCM9102 is a high-performance device; therefore, pay careful attention to device configuration and printed-circuit board layout with respect to power consumption. Observing good thermal layout practices enables the thermal pad on the backside of the 32-pin VQFN package to provide a good thermal path between the die contained within the package and the ambient air. This thermal pad also serves as the ground connection the device; therefore, a low inductance connection to the ground plane is essential.
Figure 21 shows a general recommendation of PCB layout with the CDCM9102 that ensures good system-level thermal reliability.