米6体育平台手机版

ZHCSBM6A September 2013 – January 2018 CSD13202Q2

PRODUCTION DATA.

1特性
2应用
3说明
1. Device Images
4修订历史记录
5Specifications
6器件和文档支持
7机械、封装和可订购信息
1. 7.1 Q2 封装尺寸
  1. 7.1.1 建议 PCB 布局
  2. 7.1.2 推荐的模版布局
2. 7.2 Q2 卷带信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DQK|6

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcsbm6a_oa

5.2 Thermal Characteristics

T_A = 25°C unless otherwise stated

PARAMETER		MIN	TYP	MAX	UNIT
R_θJC	Thermal resistance junction-to-case⁽¹⁾			6.4	°C/W
R_θJA	Thermal resistance junction-to-ambient⁽¹⁾⁽²⁾			60	°C/W

(1) R_θJC is determined with the device mounted on a 1-in² (6.45-cm²), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 PCB. R_θJC is specified by design, whereas R_θJA is determined by the user’s board design.

(2) Device mounted on FR4 material with 1-in² (6.45-cm²), 2-oz (0.071-mm) thick Cu.

Max R_θJA = 60 when mounted on 1 in² (6.45 cm²) of 2-oz (0.071-mm) thick Cu.

Max R_θJA = 210 when mounted on minimum pad area of 2-oz (0.071-mm) thick Cu.