ZHCSFM0A October   2016  – February 2022 CSD13380F3

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Trademarks
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

TA = 25°C (unless otherwise stated)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC CHARACTERISTICS
BVDSSDrain-to-source voltageVGS = 0 V, IDS = 250 μA12V
IDSSDrain-to-source leakage currentVGS = 0 V, VDS = 9.6 V50nA
IGSSGate-to-source leakage currentVDS = 0 V, VGS = 8 V25nA
VGS(th)Gate-to-source threshold voltageVDS = VGS, IDS = 250 μA0.550.851.30V
RDS(on)Drain-to-source on resistanceVGS = 1.8 V, IDS = 0.1 A96135mΩ
VGS = 2.5 V, IDS = 0.4 A7392
VGS = 4.5 V, IDS = 0.4 A6376
gfsTransconductanceVDS = 1.2 V, IDS = 0.4 A4.3S
DYNAMIC CHARACTERISTICS
CissInput capacitanceVGS = 0 V, VDS = 6 V,
ƒ = 1 MHz
120156pF
CossOutput capacitance81105pF
CrssReverse transfer capacitance9.612.5pF
RGSeries gate resistance16
QgGate charge total (4.5 V)VDS = 6 V, IDS = 0.4 A0.911.2nC
QgdGate charge gate-to-drain0.15nC
QgsGate charge gate-to-source0.19nC
Qg(th)Gate charge at Vth0.15nC
QossOutput chargeVDS = 6 V, VGS = 0 V0.81nC
td(on)Turnon delay timeVDS = 6 V, VGS = 4.5 V,
IDS = 0.4 A, RG = 2 Ω
4ns
trRise time4ns
td(off)Turnoff delay time11ns
tfFall time3ns
DIODE CHARACTERISTICS
VSDDiode forward voltageISD = 0.4 A, VGS = 0 V0.711V
QrrReverse recovery chargeVDS= 6 V, IF = 0.4 A, di/dt = 100 A/μs2.1nC
trrReverse recovery time8ns