ZHCSTJ9D August 2009 – October 2023 CSD16325Q5
PRODUCTION DATA
5 Thermal Characteristics
(TA = 25°C unless otherwise stated)
| PARAMETER | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Thermal Resistance Junction to Case(1) | 1 | °C/W | ||
| RθJA | Thermal Resistance Junction to Ambient(1) (2) | 50 | °C/W | ||
(1) RθJC is determined with the device mounted on a
1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a
1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB.
RθJC is specified by design, whereas RθJA is
determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2
(6.45-cm2), 2-oz. (0.071-mm thick) Cu.
|
Max RθJA = 50°C/W when mounted on 1 inch2 (6.45 cm2) of 2-oz. (0.071-mm thick) Cu. |
|
Max RθJA = 126°C/W when mounted on minimum pad area of 2-oz. (0.071-mm thick) Cu. |