ZHCSHD2D January 2018 – October 2023 CSD16401Q5
PRODUCTION DATA
5.2 Thermal Information
TA = 25°C (unless otherwise noted)
| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Thermal resistance, junction-to-case(1) | 0.8 | °C/W | ||
| RθJA | Thermal resistance, junction-to-ambient(1)(2) | 50 | °C/W | ||
(1) RθJC is determined with the device mounted on a 1-in (2.54-cm) square, 2-oz(0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 board. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu.
|
Max RθJA = 50°C/W when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu. |
|
Max RθJA = 125°C/W when mounted on minimum pad area of 2-oz (0.071-mm) thick Cu. |