米6体育平台手机版

SLPS202B August 2009 – December 2015 CSD16406Q3

PRODUCTION DATA.

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DQG|8

散热焊盘机械数据 (封装 | 引脚)

订购信息

slps202b_oa

5 Specifications

5.1 Electrical Characteristics

(T_A = 25°C unless otherwise stated)

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
STATIC CHARACTERISTICS
BV_DSS	Drain-to-source voltage	V_GS = 0 V, I_D = 250 μA	25			V
I_DSS	Drain-to-source leakage current	V_GS = 0 V, V_DS = 20 V			1	μA
I_GSS	Gate-to-source leakage current	V_DS = 0 V, V_GS = +16/–12 V			100	nA
V_GS(th)	Gate-to-source threshold voltage	V_DS = V_GS, I_D = 250 μA	1.4	1.8	2.2	V
R_DS(on)	Drain-to-source on-resistance	V_GS = 4.5 V, I_D = 20 A		5.9	7.4	mΩ
R_DS(on)	Drain-to-source on-resistance	V_GS = 10 V, I_D = 20 A		4.2	5.3	mΩ
g_fs	Transconductance	V_DS = 15 V, I_D = 20 A		53		S
DYNAMIC CHARACTERISTICS
C_ISS	Input capacitance	V_GS = 0 V, V_DS = 12.5 V, ƒ = 1 MHz		840	1100	pF
C_OSS	Output capacitance			680	950	pF
C_RSS	Reverse transfer capacitance			57	80	pF
R_g	Series gate resistance			1.2	2.4	Ω
Q_g	Gate charge total (4.5 V)	V_DS = 12.5 V, I_D = 20 A		5.8	8.1	nC
Q_gd	Gate charge gate to drain			1.5		nC
Q_gs	Gate charge gate to source			2.5		nC
Qg(th)	Gate charge at V_th			1.5		nC
Q_OSS	Output charge	V_DS = 13.6 V, V_GS = 0 V		13.9		nC
t_d(on)	Turn on delay time	V_DS = 12.5 V, V_GS = 4.5 V I_D = 20 A R_G = 2 Ω		7.3		ns
t_r	Rise time			12.9		ns
t_d(off)	Turn off delay time			8.5		ns
t_f	Fall time			4.8		ns
DIODE CHARACTERISTICS
V_SD	Diode forward voltage	I_S = 20 A, V_GS = 0 V		0.85	1.0	V
Q_rr	Reverse recovery charge	V_DD = 13.6 V, I_F = 20 A, di/dt = 300 A/μs		18		nC
t_rr	Reverse recovery time	V_DD = 13.6 V, I_F = 20 A, di/dt = 300 A/μs		22		ns

5.2 Thermal Information

(T_A = 25°C unless otherwise stated)

THERMAL METRIC		MIN	TYP	MAX	UNIT
R_θJC	Junction-to-case thermal resistance ⁽¹⁾			2.7	°C/W
R_θJA	Junction-to-ambient thermal resistance⁽¹⁾⁽²⁾			55	°C/W

(1) R_θJC is determined with the device mounted on a 1 inch² (6.45 cm²), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inch × 1.5 inch (3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. R_θJC is specified by design, whereas R_θJA is determined by the user’s board design.

(2) Device mounted on FR4 material with 1 inch² (6.45 cm²), 2 oz. (0.071 mm thick) Cu.