SLPS261B March 2010 – September 2014 CSD17309Q3
PRODUCTION DATA.
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DIM | MILLIMETERS | INCHES | ||||
---|---|---|---|---|---|---|
MIN | NOM | MAX | MIN | NOM | MAX | |
A | 0.950 | 1.000 | 1.100 | 0.037 | 0.039 | 0.043 |
A1 | 0.000 | 0.000 | 0.050 | 0.000 | 0.000 | 0.002 |
b | 0.280 | 0.340 | 0.400 | 0.011 | 0.013 | 0.016 |
b1 | 0.310 NOM | 0.012 NOM | ||||
c | 0.150 | 0.200 | 0.250 | 0.006 | 0.008 | 0.010 |
D | 3.200 | 3.300 | 3.400 | 0.126 | 0.130 | 0.134 |
D2 | 1.650 | 1.750 | 1.800 | 0.065 | 0.069 | 0.071 |
d | 0.150 | 0.200 | 0.250 | 0.006 | 0.008 | 0.010 |
d1 | 0.300 | 0.350 | 0.400 | 0.012 | 0.014 | 0.016 |
E | 3.200 | 3.300 | 3.400 | 0.126 | 0.130 | 0.134 |
E2 | 2.350 | 2.450 | 2.550 | 0.093 | 0.096 | 0.100 |
e | 0.650 TYP | 0.026 | ||||
H | 0.35 | 0.450 | 0.550 | 0.014 | 0.018 | 0.022 |
K | 0.650 TYP | 0.026 TYP | ||||
L | 0.35 | 0.450 | 0.550 | 0.014 | 0.018 | 0.022 |
L1 | 0 | — | 0 | 0 | — | 0 |
θ | 0 | — | 0 | 0 | — | 0 |
For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques.
All dimensions are in mm, unless otherwise specified.
Notes: