SLPS260E March   2010  – September 2015 CSD17313Q2

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5 Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Characteristics
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q2 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 Q2 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQK|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Mechanical, Packaging, and Orderable Information

7.1 Q2 Package Dimensions

CSD17313Q2 M0175-02_LPS260.gif
DIM MILLIMETERS INCHES
MIN NOM MAX MIN NOM MAX
A 0.700 0.750 0.800 0.028 0.030 0.032
A1 0.000 0.050 0.000 0.002
b 0.250 0.300 0.350 0.010 0.012 0.014
C 0.203 TYP 0.008 TYP
D 2.000 TYP 0.080 TYP
D1 0.900 0.950 1.000 0.036 0.038 0.040
D2 0.300 TYP 0.012 TYP
E 2.000 TYP 0.080 TYP
E1 0.900 1.000 1.100 0.036 0.040 0.044
E2 0.280 TYP 0.0112 TYP
E3 0.470 TYP 0.0188 TYP
e 0.650 BSC 0.026 TYP
K 0.280 TYP 0.0112 TYP
K1 0.350 TYP 0.014 TYP
K2 0.200 TYP 0.008 TYP
K3 0.200 TYP 0.008 TYP
K4 0.470 TYP 0.0188 TYP
L 0.200 0.25 0.300 0.008 0.010 0.012

7.2 Recommended PCB Pattern

CSD17313Q2 Recommended_PCB_Pattern.png

For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing through PCB Layout Techniques.

7.3 Recommended Stencil Pattern

CSD17313Q2 Recommended_Stencil_Pattern.png

NOTE:

All dimensions are in mm, unless otherwise specified.

7.4 Q2 Tape and Reel Information

CSD17313Q2 M0168-01_LPS235.gif

NOTES:

1. Measured from centerline of sprocket hole to centerline of pocket
2. Cumulative tolerance of 10 sprocket holes is ±0.20
3. Other material available
4. Typical SR of form tape Max 108 OHM/SQ
5. All dimensions are in mm, unless otherwise specified.
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