米6体育平台手机版

SLPS260E March 2010 – September 2015 CSD17313Q2

PRODUCTION DATA.

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DQK|6

散热焊盘机械数据 (封装 | 引脚)

订购信息

slps260e_oa

5 Specifications

5.1 Electrical Characteristics

T_A = 25°C (unless otherwise noted)

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
STATIC CHARACTERISTICS
BV_DSS	Drain-to-source voltage	V_GS = 0 V, I_D = 250 μA	30			V
I_DSS	Drain-to-source leakage	V_GS = 0 V, V_DS = 24 V			1	μA
I_GSS	Gate-to-source leakage	V_DS = 0 V, V_GS = +10 / –8 V			100	nA
V_GS(th)	Gate-to-source threshold voltage	V_DS = V_GS, I_D = 250 μA	0.9	1.3	1.8	V
R_DS(on)	Drain-to-source on resistance	V_GS = 3 V, I_D = 4 A		31	42	mΩ
		V_GS = 4.5 V, I_D = 4 A		26	32	mΩ
		V_GS = 8 V, I_D = 4 A		24	30	mΩ
g_fs	Transconductance	V_DS = 15 V, I_D = 4 A		16		S
DYNAMIC CHARACTERISTICS
C_iss	Input capacitance	V_GS = 0 V, V_DS = 15 V, ƒ = 1 MHz		260	340	pF
C_oss	Output capacitance			140	180	pF
C_rss	Reverse transfer capacitance			13	17	pF
R_G	Series gate resistance			1.3	2.6	Ω
Q_g	Gate charge total (4.5 V)	V_DS = 15 V, I_D = 4 A		2.1	2.7	nC
Q_gd	Gate charge – gate-to-drain			0.4		nC
Q_gs	Gate charge – gate-to-source			0.7		nC
Q_g(th)	Gate charge at Vth			0.3		nC
Q_oss	Output charge	V_DS = 13.5 V, V_GS = 0 V		3.8		nC
t_d(on)	Turn on delay time	V_DS = 15 V, V_GS = 4.5 V, I_D = 4 A, R_G = 2 Ω		2.8		ns
t_r	Rise time			3.9		ns
t_d(off)	Turn off delay time			4.2		ns
t_f	Fall time			1.3		ns
DIODE CHARACTERISTICS
V_SD	Diode forward voltage	I_SD = 4 A, V_GS = 0 V		0.85	1	V
Q_rr	Reverse recovery charge	V_DD= 13.5 V, I_F = 4 A, di/dt = 300 A/μs		6.4		nC
t_rr	Reverse recovery time	V_DD= 13.5 V, I_F = 4 A, di/dt = 300 A/μs		12.9		ns

5.2 Thermal Characteristics

T_A = 25°C (unless otherwise noted)

PARAMETER		MIN	TYP	MAX	UNIT
R_θJC	Thermal resistance junction-to-case⁽¹⁾			7.4	°C/W
R_θJA	Thermal resistance junction-to-ambient⁽¹⁾⁽²⁾			67	°C/W

(1) R_θJC is determined with the device mounted on a 1 inch² (6.45 cm²), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inch × 1.5 inch (3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. R_θJC is specified by design, whereas R_θJA is determined by the user’s board design.

(2) Device mounted on FR4 material with 1 inch² (6.45 cm²), 2 oz. (0.071 mm thick) Cu.