ZHCSAF2D October   2012  – September 2015 CSD17313Q2Q1

PRODUCTION DATA.  

  1. 1特性
  2. 2应用
  3. 3说明
    1.     Device Images
  4. 4修订历史记录
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6器件和文档支持
    1. 6.1 社区资源
    2. 6.2 商标
    3. 6.3 静电放电警告
    4. 6.4 Glossary
  7. 7机械、封装和可订购信息
    1. 7.1 Q2 封装尺寸
    2. 7.2 建议 PCB 布局
    3. 7.3 建议的模版布局
    4. 7.4 Q2 卷带信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQK|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC CHARACTERISTICS
BVDSS Drain-to-source voltage VGS = 0 V, ID = 250 μA 30 V
IDSS Drain-to-source leakage VGS = 0 V, VDS = 24 V 1 μA
IGSS Gate-to-source leakage VDS = 0 V, VGS = +10 / -8 V 100 nA
VGS(th) Gate-to-source threshold voltage VDS = VGS, ID = 250 μA 0.9 1.3 1.8 V
RDS(on) Drain-to-source on resistance VGS = 3 V, ID = 4 A 31 42 mΩ
VGS = 4.5 V, ID = 4 A 26 32 mΩ
VGS = 8 V, ID = 4 A 24 30 mΩ
gfs Transconductance VDS = 15 V, ID = 4 A 16 S
DYNAMIC CHARACTERISTICS
Ciss Input capacitance VGS = 0 V, VDS = 15 V,
ƒ = 1 MHz
260 340 pF
Coss Output capacitance 140 180 pF
Crss Reverse transfer capacitance 13 17 pF
RG Series gate resistance 1.3 2.6 Ω
Qg Gate charge total (4.5 V) VDS = 15 V,
ID = 4 A
2.1 2.7 nC
Qgd Gate charge – gate-to-drain 0.4 nC
Qgs Gate charge – gate-to-source 0.7 nC
Qg(th) Gate charge at Vth 0.3 nC
Qoss Output charge VDS = 13.5 V, VGS = 0 V 3.8 nC
td(on) Turn on delay time VDS = 15 V, VGS = 4.5 V,
ID = 4 A, RG = 2 Ω
2.8 ns
tr Rise time 3.9 ns
td(off) Turn off delay time 4.2 ns
tf Fall time 1.3 ns
DIODE CHARACTERISTICS
VSD Diode forward voltage ISD = 4 A, VGS = 0V 0.85 1 V
Qrr Reverse recovery charge VDD= 13.5 V, IF = 4 A,
di/dt = 300 A/μs
6.4 nC
trr Reverse recovery time 12.9 ns