ZHCS977F June 2012 – January 2025 CSD18504Q5A
PRODUCTION DATA
4.2 Thermal Information
(TA = 25°C unless otherwise stated)
| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Junction-to-Case Thermal Resistance(1) | 2.0 | °C/W | ||
| RθJA | Junction-to-Ambient Thermal Resistance(1)(2) | 50 | |||
(1) RθJC is determined with the device mounted on a 1-inch2
(6.45cm2), 2oz. (0.071mm thick) Cu pad on a 1.5-inches ×
1.5-inches
(3.81cm × 3.81cm), 0.06-inch (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(3.81cm × 3.81cm), 0.06-inch (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45cm2),
2oz. (0.071mm thick) Cu.
| Max RθJA = 50°C/W when
mounted on 1 inch2 (6.45cm2) of 2oz. (0.071mm thick) Cu. | 
| Max RθJA = 125°C/W when mounted
on a minimum pad area of 2oz. (0.071mm thick) Cu. |