ZHCSBC1C July 2013 – January 2016 CSD18563Q5A
PRODUCTION DATA.
5.2 Thermal Information
(TA = 25°C unless otherwise stated)| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Junction-to-case thermal resistance(1) | 1.3 | °C/W | ||
| RθJA | Junction-to-ambient thermal resistance(1)(2) | 50 | |||
(1) RθJC is determined with the device mounted on a 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inch × 1.5 inch (3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu.
|
Max RθJA = 50°C/W when mounted on 1 inch2 (6.45 cm2) of
2 oz. (0.071 mm thick) Cu. |
|
Max RθJA = 125°C/W when mounted on a minimum pad area of
2 oz. (0.071 mm thick) Cu. |