ZHCSCO2E May   2014  – January 2022 CSD23382F4

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 术语表
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 CSD23382F4 Embossed Carrier Tape Dimensions

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YJC|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

(TA = 25°C unless otherwise stated)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC CHARACTERISTICS
BVDSSDrain-to-Source VoltageVGS = 0 V, IDS = –250 μA–12V
IDSSDrain-to-Source Leakage CurrentVGS = 0 V, VDS = –9.6 V–1μA
IGSSGate-to-Source Leakage CurrentVDS = 0 V, VGS = –8 V–10μA
VGS(th)Gate-to-Source Threshold VoltageVDS = VGS, IDS = 250 μA–0.5–0.8–1.1V
RDS(on)Drain-to-Source On-ResistanceVGS = –1.8 V, IDS = –0.1 A149199mΩ
VGS = –2.5 V, IDS = –0.5 A90105mΩ
VGS = –4.5 V, IDS = –0.5 A6676mΩ
gƒsTransconductanceVDS = –10 V, IDS = –0.5 A3.4S
DYNAMIC CHARACTERISTICS
CissInput CapacitanceVGS = 0 V, VDS = –6 V,
ƒ = 1 MHz
180235pF
CossOutput Capacitance118154pF
CrssReverse Transfer Capacitance12.816.6pF
RGSeries Gate Resistance350
QgGate Charge Total (–4.5 V)VDS = –6 V, IDS = –0.5 A1.041.35nC
QgdGate Charge Gate-to-Drain0.15nC
QgsGate Charge Gate-to-Source0.50nC
Qg(th)Gate Charge at Vth0.18nC
QossOutput ChargeVDS = –6 V, VGS = 0 V1.08nC
td(on)Turn On Delay TimeVDS = –6 V, VGS = –4.5 V,
IDS = –0.5 A,RG = 2 Ω
28ns
trRise Time25ns
td(off)Turn Off Delay Time66ns
tƒFall Time41ns
DIODE CHARACTERISTICS
VSDDiode Forward VoltageISD = –0.5 A, VGS = 0 V–0.75–1V
QrrReverse Recovery ChargeVDS= –6 V, IF = –0.5 A, di/dt = 200 A/μs1.8nC
trrReverse Recovery Time8.4ns