ZHCS764B February   2012  – September 2022 CSD25211W1015

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Electrical Characteristics
  6. Thermal Characteristics
  7. Typical MOSFET Characteristics
  8. Mechanical Data
    1. 8.1 CSD25211W1015 Package Dimensions
    2. 8.2 Land Pattern Recommendation
  9. 静电放电警告
  10. 10Device and Documentation Support
    1. 10.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YZC|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

(TA = 25°C unless otherwise stated)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Static Characteristics
BVDSS Drain-to-Source Voltage VGS = 0 V, ID = –250 μA –20 V
BVGSS Gate-to-Source Voltage VDS = 0 V, IG = –250 μA –6.1 –7.2 V
IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = –16 V –1 μA
IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = –6 V –100 nA
VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, ID = –250 μA –0.5 –0.8 –1.1 V
RDS(on) Drain-to-Source On Resistance VGS = –2.5 V, ID = –1.5 A 36 44 mΩ
VGS = –4.5 V, ID = –1.5 A 27 33 mΩ
gfs Transconductance VDS = –10 V, ID = –1.5 A 12 S
Dynamic Characteristics
CISS Input Capacitance VGS = 0 V, VDS = –10 V, ƒ = 1 MHz 475 570 pF
COSS Output Capacitance 234 281 pF
CRSS Reverse Transfer Capacitance 10.5 13.1 pF
Qg Gate Charge Total (–4.5 V) VDS = –10 V, ID = –1.5 A 3.4 4.1 nC
Qgd Gate Charge Gate to Drain 0.2 nC
Qgs Gate Charge Gate to Source 1.1 nC
Qg(th) Gate Charge at Vth 0.6 nC
QOSS Output Charge VDS = –10 V, VGS = 0 V 3.8 nC
td(on) Turn On Delay Time VDS = –10 V, VGS = –4.5 V, ID = –1.5 A
RG = 4 Ω
13.6 ns
tr Rise Time 8.8 ns
td(off) Turn Off Delay Time 36.9 ns
tf Fall Time 14.2 ns
Diode Characteristics
VSD Diode Forward Voltage IS = –1.5 A, VGS = 0 V –0.8 –1 V
Qrr Reverse Recovery Charge Vdd= –10 V, IF = –1.5 A, di/dt = 200 A/μs 6.9 nC
trr Reverse Recovery Time 11.6 ns