ZHCSFB8B August   2016  – February 2022 CSD25485F5

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Trademarks
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

TA = 25°C (unless otherwise stated)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC CHARACTERISTICS
BVDSSDrain-to-source voltageVGS = 0 V, IDS = –250 μA–20V
IDSSDrain-to-source leakage currentVGS = 0 V, VDS = –16 V–100nA
IGSSGate-to-source leakage currentVDS = 0 V, VGS = –12 V–25nA
VGS(th)Gate-to-source threshold voltageVDS = VGS, IDS = –250 μA–0.7–0.95–1.3V
RDS(on)Drain-to-source on resistanceVGS = –1.8 V, IDS = –0.1 A89250mΩ
VGS = –2.5 V, IDS = –0.9 A5170
VGS = –4.5 V, IDS = –0.9 A3542
VGS = –8 V, IDS = –0.9 A29.735
gfsTransconductanceVDS = –2 V, IDS = –0.9 A7S
DYNAMIC CHARACTERISTICS
CissInput capacitanceVGS = 0 V, VDS = –10 V,
ƒ = 1 MHz
410533pF
CossOutput capacitance212276pF
CrssReverse transfer capacitance1723pF
RGSeries gate resistance20
QgGate charge total (–4.5 V)VDS = –10 V, IDS = –0.9 A2.73.5nC
QgdGate charge gate-to-drain0.56nC
QgsGate charge gate-to-source0.67nC
Qg(th)Gate charge at Vth0.40nC
QossOutput chargeVDS = –10 V, VGS = 0 V4.4nC
td(on)Turnon delay timeVDS = –10 V, VGS = –4.5 V,
IDS = –0.9 A, RG = 2 Ω
14ns
trRise time6ns
td(off)Turnoff delay time27ns
tfFall time14ns
DIODE CHARACTERISTICS
VSDDiode forward voltageISD = –0.9 A, VGS = 0 V–0.75–1V