ZHCSDF5A December   2014  – May 2024 CSD85301Q2

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 接收文档更新通知
    2. 5.2 支持资源
    3. 5.3 Trademarks
    4. 5.4 静电放电警告
    5. 5.5 术语表
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Package Dimensions
    2. 7.2 PCB Land Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
  • DLV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.