米6体育平台手机版

ZHCSHU1 March 2018 CSD86336Q3D

PRODUCTION DATA.

1特性
2应用
3说明
1. 俯视图
  1. Device Images
4修订历史记录
5Specifications
6Application and Implementation
7Layout
1. 7.1 Recommended Schematic Overview
2. 7.2 Recommended PCB Design Overview
  1. 7.2.1 Electrical Performance
  2. 7.2.2 Thermal Performance
8器件和文档支持
9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)

DPB|8
- MPSS062C

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcshu1_oa
zhcshu1_pm

5.7 Typical Power Block Device Characteristics

Test conditions: V_IN = 12 V, V_DD = 5 V, ƒ_SW = 500 kHz, V_OUT = 1.3 V, L_OUT = 0.95 µH, I_OUT = 20 A, T_J = 125°C, unless stated otherwise.

Figure 1. Power Loss vs Output Current

Figure 3. Typical Safe Operating Area (SOA) ⁽¹⁾

Figure 2. Power Loss vs Temperature

Figure 4. Normalized Power Loss vs Switching Frequency

Figure 6. Normalized Power Loss vs Output Voltage

Figure 5. Normalized Power Loss vs Input Voltage

Figure 7. Normalized Power Loss vs Output Inductance

1. The Typical Power Block System Characteristic curves are based on measurements made on a PCB design with dimensions of 4 in (W) × 3.5 in (L) × 0.062 in (H) and 6 copper layers of 1-oz copper thickness. See Application and Implementation section for detailed explanation.