米6体育平台手机版

ZHCSHU1 March 2018 CSD86336Q3D

PRODUCTION DATA.

1特性
2应用
3说明
1. 俯视图
  1. Device Images
4修订历史记录
5Specifications
6Application and Implementation
7Layout
1. 7.1 Recommended Schematic Overview
2. 7.2 Recommended PCB Design Overview
  1. 7.2.1 Electrical Performance
  2. 7.2.2 Thermal Performance
8器件和文档支持
9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)

DPB|8
- MPSS062C

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcshu1_oa
zhcshu1_pm

5.3 Thermal Information

T_A = 25°C (unless otherwise noted)

THERMAL METRIC		MAX	UNIT
R_θJA	Junction-to-ambient thermal resistance (min Cu)⁽¹⁾	105	°C/W
R_θJA	Junction-to-ambient thermal resistance (max Cu)⁽¹⁾⁽²⁾	55	°C/W
R_θJC	Junction-to-case thermal resistance (top of package)⁽¹⁾	17	°C/W
R_θJC	Junction-to-case thermal resistance (P_GND pin)⁽¹⁾	3.2	°C/W

(1) R_θJC is determined with the device mounted on a 1-in² (6.45-cm²), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in
(3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 board. R_θJC is specified by design while R_θJA is determined by the user’s board
design.

(2) Device mounted on FR4 material with 1-in² (6.45-cm²) Cu.