米6体育平台手机版

ZHCSAE5B September 2012 – April 2018 CSD86360Q5D

PRODUCTION DATA.

1特性
2应用
3说明
1. 3.1 俯视图
  1. Device Images
4修订历史记录
5Specifications
6Application and Implementation
1. 6.1 Application Information
2. 6.2 Typical Application
  1. 6.2.1 Design Example: Calculating Power Loss and SOA
7Layout
1. 7.1 Layout Guidelines
  1. 7.1.1 Electrical Performance
  2. 7.1.2 Thermal Performance
2. 7.2 Layout Example
8器件和文档支持
9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)

DQY|8
- MPSS031A

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcsae5b_oa
zhcsae5b_pm

5.4 Thermal Information

T_A = 25°C (unless otherwise stated)

THERMAL METRIC		MAX	UNIT
R_θJA	Junction-to-ambient thermal resistance (min Cu)⁽¹⁾	102	°C/W
R_θJA	Junction-to-ambient thermal resistance (max Cu)⁽¹⁾⁽²⁾	50	°C/W
R_θJC	Junction-to-case thermal resistance (top of package)⁽¹⁾	20	°C/W
R_θJC	Junction-to-case thermal resistance (P_GND pin)⁽¹⁾	2	°C/W

(1) R_θJC is determined with the device mounted on a 1-in² (6.45-cm²), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in
(3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 board. R_θJC is specified by design while R_θJA is determined by the user’s board design.

(2) Device mounted on FR4 material with 1-in² (6.45-cm²) Cu.