米6体育平台手机版

ZHCSEO0B February 2016 – April 2018 CSD87335Q3D

PRODUCTION DATA.

1特性
2应用
3说明
1. 俯视图
  1. Device Images
4修订历史记录
5Specifications
6Applications and Implementation
7Recommended PCB Design Overview
1. 7.1 Electrical Performance
2. 7.2 Thermal Performance
8器件和文档支持
9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)

DQZ|8
- MPSS032C

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcseo0b_oa

5.3 Thermal Information

T_A = 25°C (unless otherwise stated)

THERMAL METRIC		MAX	UNIT
R_θJA	Junction-to-ambient thermal resistance (min Cu)⁽²⁾	135	°C/W
R_θJA	Junction-to-ambient thermal resistance (max Cu)⁽²⁾⁽¹⁾	73	°C/W
R_θJC	Junction-to-case thermal resistance (top of package)⁽²⁾	29	°C/W
R_θJC	Junction-to-case thermal resistance (P_GND pin)⁽²⁾	2.5	°C/W

(1) Device mounted on FR4 material with 1-in² (6.45-cm²) Cu.

(2) R_θJC is determined with the device mounted on a 1-in² (6.45-cm²), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in
(3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 board. R_θJC is specified by design while R_θJA is determined by the user’s board design.