ZHCSGQ9 September 2017 CSD87503Q3E
PRODUCTION DATA.
5.2 Thermal Information
TA = 25°C (unless otherwise stated)| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Junction-to-case thermal resistance(1) | 8 | °C/W | ||
| RθJA | Junction-to-ambient thermal resistance(1)(2) | 60 | °C/W | ||
(1) RθJC is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu.
 |
Max RθJA = 60°C/W when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu. |
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Max RθJA = 185°C/W when mounted on a minimum pad area of 2-oz (0.071-mm) thick Cu. |