(TA = 25°C unless otherwise stated)| THERMAL METRIC | MIN | TYP | MAX | UNIT |
|---|
| RθJL | Junction-to-Lead Thermal Resistance(1) | | | 20 | °C/W |
| RθJA | Junction-to-Ambient Thermal Resistance(1)(2) | | | 75 |
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.