ZHCSOX2 January   2023 CSD95411

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 5.2 Documentation Support
    3. 5.3 接收文档更新通知
    4. 5.4 支持资源
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 术语表
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3. 6.3 Mechanical Drawing
    4. 6.4 Recommended PCB Land Pattern
    5. 6.5 Recommended Stencil Opening
    6. 6.6 Alternate Industry Standard Compatible PCB Land Pattern
    7. 6.7 Alternate Industry Standard Compatible Stencil Opening

封装选项

机械数据 (封装 | 引脚)
  • RRB|41
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Mechanical Drawing

GUID-CD1121BF-4664-4D97-BFEC-8E628A366621-low.png

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.
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