ZHCSRG5
January 2023
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device and Documentation Support
5.1
Documentation Support
5.1.1
Related Documentation
5.2
接收文档更新通知
5.3
支持资源
5.4
Trademarks
5.5
Electrostatic Discharge Caution
5.6
术语表
6
Mechanical, Packaging, and Orderable Information
6.1
Package Option Addendum
6.2
Tape and Reel Information
6.3
Mechanical Drawing
6.4
Recommended PCB Land Pattern
6.5
Recommended Stencil Opening
6.6
Alternate Industry Standard Compatible PCB Land Pattern
6.7
Alternate Industry Standard Compatible Stencil Opening
封装选项
机械数据 (封装 | 引脚)
RRB|41
散热焊盘机械数据 (封装 | 引脚)
6.3
Mechanical Drawing
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
This drawing is subject to change without notice.
The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.
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