ZHCSRG5 January   2023

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Documentation Support
      1. 5.1.1 Related Documentation
    2. 5.2 接收文档更新通知
    3. 5.3 支持资源
    4. 5.4 Trademarks
    5. 5.5 Electrostatic Discharge Caution
    6. 5.6 术语表
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3. 6.3 Mechanical Drawing
    4. 6.4 Recommended PCB Land Pattern
    5. 6.5 Recommended Stencil Opening
    6. 6.6 Alternate Industry Standard Compatible PCB Land Pattern
    7. 6.7 Alternate Industry Standard Compatible Stencil Opening

封装选项

机械数据 (封装 | 引脚)
  • RRB|41
散热焊盘机械数据 (封装 | 引脚)

6.4 Recommended PCB Land Pattern

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  1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
  2. This drawing is subject to change without notice.
  3. This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON PCB Attachment (SLUA271).
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