SNAS424D August   2007  – April 2016 DAC088S085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC and Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Architecture
      2. 8.3.2 Output Amplifiers
      3. 8.3.3 Reference Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Daisy Chain Operation
      3. 8.5.3 Serial Input Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Examples Programming the DAC088S085
        1. 9.1.1.1 Updating DAC Outputs Simultaneously
        2. 9.1.1.2 Updating DAC Outputs Independently
      2. 9.1.2 Bipolar Operation
      3. 9.1.3 Variable Current Source Output
      4. 9.1.4 DSP and Microprocessor Interfacing
        1. 9.1.4.1 ADSP-2101 and ADSP2103 Interfacing
        2. 9.1.4.2 80C51 and 80L51 Interface
        3. 9.1.4.3 68HC11 Interface
        4. 9.1.4.4 Microwire Interface
      5. 9.1.5 Industrial Application
    2. 9.2 Typical Applications
      1. 9.2.1 ADC Reference
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Programmable Attenuator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4132
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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