ZHCSEO3B April   2012  – January 2016 DAC101C081 , DAC101C081Q , DAC101C085

PRODUCTION DATA.  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 修订历史记录
5. 5 说明 （续）
6. 6 Device Comparison Table
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1 Absolute Maximum Ratings
   2. 8.2 ESD Ratings
   3. 8.3 Recommended Operating Conditions
   4. 8.4 Thermal Information
   5. 8.5 Electrical Characteristics
   6. 8.6 AC and Timing Characteristics
   7. 8.7 Typical Characteristics
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 DAC Section
      2. 9.3.2 Output Amplifier
      3. 9.3.3 Reference Voltage
      4. 9.3.4 Power-On Reset
      5. 9.3.5 Simultaneous Reset
      6. 9.3.6 Additional Timing Information: toutz
   4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Modes
   5. 9.5 Programming
      1. 9.5.1 Serial Interface
      2. 9.5.2 Basic I2C™ Protocol
      3. 9.5.3 Standard-Fast Mode
      4. 9.5.4 High-Speed (Hs) Mode
      5. 9.5.5 I2C Slave (Hardware) Address
      6. 9.5.6 Writing to the DAC Register
      7. 9.5.7 Reading from the DAC Register
   6. 9.6 Registers
      1. 9.6.1 DAC Register
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Bipolar Operation
       2. 10.1.2 DSP/Microprocessor Interfacing
          1. 10.1.2.1 Interfacing to the 2-wire Bus
          2. 10.1.2.2 Interfacing to a Hs-mode Bus
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
       3. 10.2.3 Application Curve
11. 11Power Supply Recommendations
    1. 11.1 Using References as Power Supplies
       1. 11.1.1 LM4132
       2. 11.1.2 LM4050
       3. 11.1.3 LP3985
       4. 11.1.4 LP2980
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13器件和文档支持
    1. 13.1 器件支持
       1. 13.1.1 器件命名规则
          1. 13.1.1.1 技术规格定义
    2. 13.2 相关链接
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
14. 14机械、封装和可订购信息