ZHCS597B December   2011  – May 2015 DAC1282

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements: Serial Peripheral Interface (SPI) Timing
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Feature Description
      1. 8.2.1  Signal Output (VOUTP, VOUTN)
      2. 8.2.2  DAC Modes
        1. 8.2.2.1 Sine Mode
        2. 8.2.2.2 DC Mode
        3. 8.2.2.3 Pulse Mode
        4. 8.2.2.4 Digital Data Mode
      3. 8.2.3  Reference Voltage (VREF)
      4. 8.2.4  Output Filter (CAPP, CAPN)
      5. 8.2.5  Output Switch (SWINP, SWINN, SWOUTP, SWOUTN)
      6. 8.2.6  Clock Input (CLK)
      7. 8.2.7  Switch Control/External Digital Input (SW/TD)
        1. 8.2.7.1 SW Function
        2. 8.2.7.2 TD Function
      8. 8.2.8  SYNC
      9. 8.2.9  RESET/PWDN
      10. 8.2.10 AVDD, AVSS, and DVDD Power Supplies
        1. 8.2.10.1 Power Consumption
        2. 8.2.10.2 Offset and Gain Error
        3. 8.2.10.3 Signal-to-Noise Ratio (SNR)
        4. 8.2.10.4 DC Noise
        5. 8.2.10.5 Total Harmonic Distortion (THD)
      11. 8.2.11 Step Response
      12. 8.2.12 Frequency Response
    3. 8.3 Device Functional Modes
      1. 8.3.1 Serial Interface
        1. 8.3.1.1 Serial Communications
        2. 8.3.1.2 Chip Select (CS)
        3. 8.3.1.3 Serial Clock (SCLK)
        4. 8.3.1.4 Data Input (DIN)
        5. 8.3.1.5 Data Output (DOUT)
      2. 8.3.2 SPI Timeout
    4. 8.4 Programming
      1. 8.4.1 Commands
        1. 8.4.1.1 RREG: Read From Registers
        2. 8.4.1.2 WREG: Write To Registers
        3. 8.4.1.3 RESET: Device Reset
    5. 8.5 Register Map
      1. 8.5.1 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Channel Seismic System
      2. 9.2.2 Four-Channel Seismic System
  10. 10器件和文档支持
    1. 10.1 Community Resources
    2. 10.2 商标
    3. 10.3 静电放电警告
    4. 10.4 术语表
  11. 11机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 器件和文档支持

10.1 Community Resources

The following links connect to TI community resources. Linked contents are provided AS IS by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.2 商标

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola.

All other trademarks are the property of their respective owners.

10.3 静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

10.4 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。
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