SNAS407H August   2007  – April 2015 DAC128S085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC and Timing Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Architecture
      2. 8.3.2 Output Amplifiers
      3. 8.3.3 Reference Voltage
      4. 8.3.4 Serial Interface
      5. 8.3.5 Daisy-Chain Operation
      6. 8.3.6 DAC Input Data Update Mechanism
      7. 8.3.7 Power-On Reset
      8. 8.3.8 Transfer Characteristic
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Programming the DAC128S085
        1. 8.5.1.1 Updating DAC Outputs Simultaneously
        2. 8.5.1.2 Updating DAC Outputs Independently
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Using References as Power Supplies
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Specification Definitions
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from G Revision (January 2015) to H Revision

  • Switched WQFN and TSSOP pinouts to their correct titles Go
  • Re-drew TSSOP pinout as a square to better reflect mechanical packaging drawings Go

Changes from F Revision (March 2013) to G Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from E Revision (March 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo
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