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ZHCSLO2E October 2020 – January 2021 DAC5652

PRODUCTION DATA

6.4 Thermal Resistance Characteristics

THERMAL METRIC⁽¹⁾		DAC5652	UNIT
		TQFP (PFB)
		48-Pins
R _θJA	Junction-to-ambient thermal resistance	65.3	°C/W
R _θJC(top)	Junction-to-case (top) thermal resistance	16.4	°C/W
R _θJB	Junction-to-board thermal resistance	28.6	°C/W
ψ _JT	Junction-to-top characterization parameter	0.4	°C/W
ψ _JB	Junction-to-board characterization parameter	28.4	°C/W
R _θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.