SGLS386F
January 2009 – October 2014
DAC5670-SP
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
Handling Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
DC Electrical Characteristics
7.6
AC Electrical Characteristics
7.7
Digital Electrical Characteristics
7.8
Timing Requirements
7.9
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Digital Inputs
8.3.2
DLL Usage
8.3.3
Clock Input
8.3.4
DAC Transfer Function
8.3.5
Reference Operation
8.3.6
Analog Current Outputs
8.3.7
Sleep Mode
8.4
Device Functional Modes
8.4.1
Input Format
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Device Nomenclature
12.1.1.1
Definitions of Specifications and Terminology
12.2
Trademarks
12.3
Electrostatic Discharge Caution
12.4
Glossary
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
GEM|192
散热焊盘机械数据 (封装 | 引脚)
订购信息
sgls386f_oa
11 Layout
11.1 Layout Guidelines
DAC output termination should be placed as close as possible to outputs.
Keep routing for RBIAS short.
Decoupling capacitors should be placed as close as possible to supply pins.
Digital differential inputs must be 50 Ω to ground loosely coupled, or 100-Ω differential tightly coupled.
Digital differential inputs must be length matched.
11.2 Layout Example
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