ZHCSEG7A December   2015  – January 2016 DAC60096

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DAC DC
    6. 6.6  Electrical Characteristics: Square-Wave Output
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements
    9. 6.9  Typical Characteristics: DC Mode
    10. 6.10 Typical Characteristics: Toggle Mode
    11. 6.11 Typical Characteristics, General
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converters (DACs)
        1. 7.3.1.1 DAC Transfer Function
        2. 7.3.1.2 DAC Register Structure
      2. 7.3.2 Reference Specifications
    4. 7.4 Device Functional Modes
      1. 7.4.1 Toggle Mode
      2. 7.4.2 DC Mode
    5. 7.5 Programming
      1. 7.5.1 Frame Error Checking
    6. 7.6 Register Maps
      1. 7.6.1 8.5.1 BUFA Register (address = 0x0) [reset = 0x0000]
      2. 7.6.2 BUFB Register (address = 0x1) [reset = 0x0000]
      3. 7.6.3 CON Register (address = 0x4) [reset = 0x0555]
      4. 7.6.4 CRC Register (address = 0x5) [reset = 0xFFF]
      5. 7.6.5 PTR Register (address = 0x6) [reset = 0x0000]
      6. 7.6.6 SWR Register (address = 0x7) [reset = 0x0000]
      7. 7.6.7 PWRM Register (address = 0x6) [reset = 0xCAFE]
      8. 7.6.8 SDIV Register (address = 0x9) [reset = 0x0000]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power-Supply Bypassing
        2. 8.2.2.2 Reference Input
        3. 8.2.2.3 TRIGG/Signal Conditioning
        4. 8.2.2.4 External Amplifier Selection
        5. 8.2.2.5 Unbuffered Settling Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Device Reset Options
      1. 9.1.1 Power-on-Reset (POR)
      2. 9.1.2 Hardware Reset
      3. 9.1.3 Software Reset
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Optimal Layout Example
      2. 10.2.2 Standard Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 文档支持

11.1.1 相关文档　

《LM231 数据表》，SNOSBI2

11.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 商标

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola Inc.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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