ZHCSRX3 april   2023 DAC63202W

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Current Output
    7. 6.7  Electrical Characteristics: Comparator Mode
    8. 6.8  Electrical Characteristics: General
    9. 6.9  Timing Requirements: I2C Standard Mode
    10. 6.10 Timing Requirements: I2C Fast Mode
    11. 6.11 Timing Requirements: I2C Fast Mode Plus
    12. 6.12 Timing Requirements: SPI Write Operation
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 6.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 6.15 Timing Requirements: GPIO
    16. 6.16 Timing Diagrams
    17. 6.17 Typical Characteristics: Voltage Output
    18. 6.18 Typical Characteristics: Current Output
    19. 6.19 Typical Characteristics: Comparator
    20. 6.20 Typical Characteristics: General
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 7.3.2 Digital Input/Output
      3. 7.3.3 Nonvolatile Memory (NVM)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage-Output Mode
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
          1. 7.4.1.1.1 Internal Reference
          2. 7.4.1.1.2 External Reference
          3. 7.4.1.1.3 Power-Supply as Reference
      2. 7.4.2 Current-Output Mode
      3. 7.4.3 Comparator Mode
        1. 7.4.3.1 Programmable Hysteresis Comparator
        2. 7.4.3.2 Programmable Window Comparator
      4. 7.4.4 Fault-Dump Mode
      5. 7.4.5 Application-Specific Modes
        1. 7.4.5.1 Voltage Margining and Scaling
          1. 7.4.5.1.1 High-Impedance Output and PROTECT Input
          2. 7.4.5.1.2 Programmable Slew-Rate Control
          3. 7.4.5.1.3 PMBus Compatibility Mode
        2. 7.4.5.2 Function Generation
          1. 7.4.5.2.1 Triangular Waveform Generation
          2. 7.4.5.2.2 Sawtooth Waveform Generation
          3. 7.4.5.2.3 Sine Waveform Generation
      6. 7.4.6 Device Reset and Fault Management
        1. 7.4.6.1 Power-On Reset (POR)
        2. 7.4.6.2 External Reset
        3. 7.4.6.3 Register-Map Lock
        4. 7.4.6.4 NVM Cyclic Redundancy Check (CRC)
          1. 7.4.6.4.1 NVM-CRC-FAIL-USER Bit
          2. 7.4.6.4.2 NVM-CRC-FAIL-INT Bit
      7. 7.4.7 Power-Down Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
      3. 7.5.3 General-Purpose Input/Output (GPIO) Modes
    6. 7.6 Register Map
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-X-MARGIN-HIGH Register (address = 13h, 01h) [reset = 0000h]
      3. 7.6.3  DAC-X-MARGIN-LOW Register (address = 14h, 02h) [reset = 0000h]
      4. 7.6.4  DAC-X-VOUT-CMP-CONFIG Register (address = 15h, 03h) [reset = 0000h]
      5. 7.6.5  DAC-X-IOUT-MISC-CONFIG Register (address = 16h, 04h) [reset = 0000h]
      6. 7.6.6  DAC-X-CMP-MODE-CONFIG Register (address = 17h, 05h) [reset = 0000h]
      7. 7.6.7  DAC-X-FUNC-CONFIG Register (address = 18h, 06h) [reset = 0000h]
      8. 7.6.8  DAC-X-DATA Register (address = 1Ch, 19h) [reset = 0000h]
      9. 7.6.9  COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
      10. 7.6.10 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      11. 7.6.11 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
      12. 7.6.12 GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
      13. 7.6.13 CMP-STATUS Register (address = 23h) [reset = 0000h]
      14. 7.6.14 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
      15. 7.6.15 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
      16. 7.6.16 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      17. 7.6.17 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      18. 7.6.18 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      19. 7.6.19 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
      20. 7.6.20 PMBUS-PAGE Register [reset = 0300h]
      21. 7.6.21 PMBUS-OP-CMD-X Register [reset = 0000h]
      22. 7.6.22 PMBUS-CML Register [reset = 0000h]
      23. 7.6.23 PMBUS-VERSION Register [reset = 2200h]
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

DAC63202W 是一款 12 位、双通道、缓冲、电压输出和电流输出智能数模转换器 (DAC)。这些 DAC63202W 器件支持高阻态断电模式,并在断电情况下支持高阻态输出。DAC 输出提供一个强制检测选项,可用作可编程比较器和电流阱。得益于多功能 GPIO、函数生成和可编程的非易失性存储器 (NVM),此类智能 DAC 可用于无处理器的 应用和设计复用。该器件自动检测 I2C、SPI 和 PMBus 接口,并包含内部基准。

这些功能集与微型封装和低功耗相结合,使该智能 DAC 成为电压裕量和调节、偏置和校准用直流设定点以及波形生成等应用的理想选择。

封装信息
器件型号 封装(1) 封装尺寸(标称值)
DAC63202W YBH(DSBGA,16) 1.72mm × 1.72mm
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
GUID-20221114-SS0I-3LHN-R7SM-VHGMNP7CK05D-low.svg使用 DAC63202W 实现电压裕量和调节