ZHCSNR2A December   2021  – May 2024 DAC43508 , DAC53508 , DAC63508

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: SPI
    7. 5.7  Timing Requirements: Logic
    8. 5.8  Timing Diagrams
    9. 5.9  Typical Characteristics: Static Performance
    10. 5.10 Typical Characteristics: Dynamic Performance
    11. 5.11 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 6.3.1.1 DAC Transfer Function
        2. 6.3.1.2 DAC Register Update and LDAC Functionality
        3. 6.3.1.3 CLR Functionality
        4. 6.3.1.4 Output Amplifier
      2. 6.3.2 Reference
      3. 6.3.3 Power-On Reset (POR)
      4. 6.3.4 Software Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Mode
    5. 6.5 Programming
      1. 6.5.1 Serial Peripheral Interface (SPI)
  8. 7 Register Map
    1. 7.1 DEVICE_CONFIG Register (address = 01h) [reset = 00FFh]
    2. 7.2 STATUS_TRIGGER Register (address = 02h) [reset = 0000h]
    3. 7.3 BRDCAST Register (address = 03h) [reset = 0000h]
    4. 7.4 DACn_DATA Register (address = 08h to 0Fh) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Programmable LED Biasing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Programmable Window Comparator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

5.6 Timing Requirements: SPI

all inputs signals are specified with tR = tF = 1 V/ns (10% to 90% of VDD) and timed from a voltage level of VDD/2,
1.8 V ≤ VDD ≤ 5.5 V and –40°C ≤ TA ≤ +125°C
MIN NOM MAX UNIT
f(SCLK) Serial clock frequency, 1.7 V ≤ VDD < 2.7 V 25 MHz
Serial clock frequency, 2.7 V ≤ VDD ≤ 5.5 V 50
tSCLKHIGH SCLK high time, 1.7 V ≤ VDD < 2.7 V 20 ns
SCLK high time, 2.7 V ≤ VDD ≤ 5.5 V 10
tSCLKLOW SCLK low time, 1.7 V ≤ VDD < 2.7 V 20 ns
SCLK low time, 2.7 V ≤ VDD ≤ 5.5 V 10
tSDIS SDI setup time, 1.7 V ≤ VDD < 2.7 V 16 ns
SDI setup time, 2.7 V ≤ VDD ≤ 5.5 V 8
tSDIH SDI hold time, 1.7 V ≤ VDD < 2.7 V 10 ns
SDI hold time, 2.7 V ≤ VDD ≤ 5.5 V 5
tCSS SYNC to SCLK falling edge setup time, 1.7 V ≤ VDD < 2.7 V 36 ns
SYNC to SCLK falling edge setup time, 2.7 V ≤ VDD ≤ 5.5 V 18
tCSH SCLK falling edge to SYNC rising edge, 1.7 V ≤ VDD < 2.7 V 10 ns
SCLK falling edge to SYNC rising edge, 2.7 V ≤ VDD ≤ 5.5 V 5
tCSHIGH SYNC high time, 1.7 V ≤ VDD < 2.7 V 50 ns
SYNC high time, 2.7 V ≤ VDD ≤ 5.5 V 25
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