These devices also provide an alarm detection feature. When one or more of following events occur, the ALARM pin goes low:

• The current output load is in open circuit,
• The voltage at IOUT reaches a level where accuracy of the output current is compromised. This condition is detected by monitoring internal voltage levels of the IOUT circuitry and is typically below the specified compliance voltage headroom (defined as the voltage drop between the AVDD and IOUT pins) minimum of 2 V,
• The die temperature exceeds 142°C,
• The SPI watchdog timer exceeds the timeout period (if enabled), or
• The SPI frame error CRC check encounters an error (if enabled).

When the ALARM pins of multiple DACx750 devices are connected together to form a wired-AND function, the host processor must read the status register of each device to know all the fault conditions that are present. Note that the thermal alarm has hysteresis of approximately 18°C. After being set, the alarm only resets when the die temperature drops below 124°C.