ZHCSBX4D June   2013  – December 2021 DAC7760 , DAC8760

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics: AC
    7. 7.7  Timing Requirements: Write Mode
    8. 7.8  Timing Requirements: Readback Mode
    9. 7.9  Timing Diagrams
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  DAC Architecture
      2. 8.3.2  Voltage Output Stage
      3. 8.3.3  Current Output Stage
      4. 8.3.4  Internal Reference
      5. 8.3.5  Digital Power Supply
      6. 8.3.6  DAC Clear
      7. 8.3.7  Power-On Reset
      8. 8.3.8  Alarm Detection
      9. 8.3.9  Watchdog Timer
      10. 8.3.10 Frame Error Checking
      11. 8.3.11 User Calibration
      12. 8.3.12 Programmable Slew Rate
    4. 8.4 Device Functional Modes
      1. 8.4.1 Setting Voltage and Current Output Ranges
      2. 8.4.2 Boost Configuration for IOUT
      3. 8.4.3 Filtering the Current Output (only on the VQFN package)
      4. 8.4.4 HART Interface
        1. 8.4.4.1 For 4-mA to 20-mA Mode
        2. 8.4.4.2 For All Current Output Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 SPI Shift Register
        2. 8.5.1.2 Write Operation
        3. 8.5.1.3 Read Operation
        4. 8.5.1.4 Stand-Alone Operation
        5. 8.5.1.5 Multiple Devices on the Bus
    6. 8.6 Register Maps
      1. 8.6.1 DACx760 Command and Register Map
        1. 8.6.1.1 DACx760 Register Descriptions
          1. 8.6.1.1.1 Control Register
          2. 8.6.1.1.2 Configuration Register
          3. 8.6.1.1.3 DAC Registers
          4. 8.6.1.1.4 Reset Register
          5. 8.6.1.1.5 Status Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Controlling the VOUT and IOUT Pins
        1. 9.1.1.1 VOUT and IOUT Pins are Independent Outputs, Never Simultaneously Enabled
        2. 9.1.1.2 VOUT and IOUT Pins are Independent Outputs, Simultaneously Enabled
        3. 9.1.1.3 VOUT and IOUT Pins are Tied Together, Never Simultaneously Enabled
      2. 9.1.2 Implementing HART in All Current Output Modes
        1. 9.1.2.1 Using CAP2 Pin on VQFN Package
        2. 9.1.2.2 Using the ISET-R Pin
      3. 9.1.3 Short-Circuit Current Limiting
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.8 Timing Requirements: Readback Mode

At TA = –40°C to +125°C and DVDD = 2.7 V to 5.5 V, unless otherwise noted. See Figure 7-2 for timing diagram.
PARAMETER(1)MINMAXUNIT
t11SCLK cycle time60ns
t12SCLK low time25ns
t13SCLK high time25ns
t14LATCH delay time13ns
t15LATCH high time40ns
t16Data setup time5ns
t17Data hold time7ns
t18LATCH low time40ns
t19Serial output delay time (CL, SDO = 15 pF)35ns
t20LATCH rising edge to SDO 3-state (CL, SDO = 15 pF)35ns
(1) Specified by design, not production tested.
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