ZHCSBX4D June   2013  – December 2021 DAC7760 , DAC8760

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics: AC
    7. 7.7  Timing Requirements: Write Mode
    8. 7.8  Timing Requirements: Readback Mode
    9. 7.9  Timing Diagrams
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  DAC Architecture
      2. 8.3.2  Voltage Output Stage
      3. 8.3.3  Current Output Stage
      4. 8.3.4  Internal Reference
      5. 8.3.5  Digital Power Supply
      6. 8.3.6  DAC Clear
      7. 8.3.7  Power-On Reset
      8. 8.3.8  Alarm Detection
      9. 8.3.9  Watchdog Timer
      10. 8.3.10 Frame Error Checking
      11. 8.3.11 User Calibration
      12. 8.3.12 Programmable Slew Rate
    4. 8.4 Device Functional Modes
      1. 8.4.1 Setting Voltage and Current Output Ranges
      2. 8.4.2 Boost Configuration for IOUT
      3. 8.4.3 Filtering the Current Output (only on the VQFN package)
      4. 8.4.4 HART Interface
        1. 8.4.4.1 For 4-mA to 20-mA Mode
        2. 8.4.4.2 For All Current Output Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 SPI Shift Register
        2. 8.5.1.2 Write Operation
        3. 8.5.1.3 Read Operation
        4. 8.5.1.4 Stand-Alone Operation
        5. 8.5.1.5 Multiple Devices on the Bus
    6. 8.6 Register Maps
      1. 8.6.1 DACx760 Command and Register Map
        1. 8.6.1.1 DACx760 Register Descriptions
          1. 8.6.1.1.1 Control Register
          2. 8.6.1.1.2 Configuration Register
          3. 8.6.1.1.3 DAC Registers
          4. 8.6.1.1.4 Reset Register
          5. 8.6.1.1.5 Status Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Controlling the VOUT and IOUT Pins
        1. 9.1.1.1 VOUT and IOUT Pins are Independent Outputs, Never Simultaneously Enabled
        2. 9.1.1.2 VOUT and IOUT Pins are Independent Outputs, Simultaneously Enabled
        3. 9.1.1.3 VOUT and IOUT Pins are Tied Together, Never Simultaneously Enabled
      2. 9.1.2 Implementing HART in All Current Output Modes
        1. 9.1.2.1 Using CAP2 Pin on VQFN Package
        2. 9.1.2.2 Using the ISET-R Pin
      3. 9.1.3 Short-Circuit Current Limiting
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (January 2018) to Revision D (December 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Changed CMP pin description in Pin Functions table to include 100-pF capacitance to groundGo
  • Deleted Timing Requirements: Daisy-Chain Mode section and Daisy-Chain Mode Timing figureGo
  • Added 100-pF capacitance to ground for larger external compensation capacitors in Voltage Output Stage sectionGo
  • Deleted Power-Supply Sequence sectionGo
  • Deleted daisy-chain operation content from Watchdog Timer sectionGo
  • Deleted The DACx760 Shares the SPI Bus With Other Devices subsection from Watchdog Timer sectionGo
  • Deleted daisy-chain operation content from Frame Error Checking sectionGo
  • Added CRC fault software reset command of 0x96 to Frame Error Checking sectionGo
  • Deleted The DACx760 Shares the SPI Bus With Other Devices subsection from Frame Error Checking sectionGo
  • Changed duplicated 010 step-size from 0.125 to 0.25 in Table 8-3, Slew Rate Step-Size Options Go
  • Added CRC fault reset command to Table 8-8, Write Address Functions Go
  • Deleted Daisy-Chain Operation sectionGo
  • Added Multiple Devices on the Bus sectionGo
  • Changed Command and Register Map table to delete daisy-chain operation content and add CRC fault reset contentGo
  • Changed DCEN to Reserved for DB3 in Table 8-17, Control Register Go
  • Added series resistance for supply and 100-pF capacitance from CMP to GND for Figure 9-3Go
  • Added text on fast supply ramp, series resistance for power supply, and content from deleted Power-Supply Sequence to the Power Supply Recommendations sectionGo
  • Added power supply series resistance and CMP capacitor to GND to Figure 11-1, Layout Example Go

Changes from Revision B (June 2016) to Revision C (January 2018)

  • Added first sentence to second paragraph and added last paragraph to Frame Error Checking sectionGo
  • Added last paragraph to User Calibration section Go
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