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ZHCSHU4E April 2005 – March 2018 DAC7811

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		DAC7811	UNIT
		DGS (VSSOP)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	165.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	55.4	°C/W
R_θJB	Junction-to-board thermal resistance	85.6	°C/W
ψ_JT	Junction-to-top characterization parameter	6.2	°C/W
ψ_JB	Junction-to-board characterization parameter	84.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.