SBAS246B December   2001  – November 2014 DAC8532

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Resistor String
      3. 8.3.3 Output Amplifier
      4. 8.3.4 Serial Interface
      5. 8.3.5 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Input Shift Register
      2. 8.4.2 SYNC Interrupt
      3. 8.4.3 Power-Down Modes
    5. 8.5 Register Maps
      1. 8.5.1 Operation Examples
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Current Consumption
      2. 9.1.2 Driving Resistive and Capacitive Loads
      3. 9.1.3 Crosstalk and AC Performance
      4. 9.1.4 Output Voltage Stability
      5. 9.1.5 Settling Time and Output Glitch Performance
      6. 9.1.6 Microprocessor Interfacing
        1. 9.1.6.1 DAC8532 to 8051 Interface
        2. 9.1.6.2 DAC8532 to Microwire Interface
        3. 9.1.6.3 DAC8532 to 68HC11 Interface
      7. 9.1.7 DAC8532 to TMS320 DSP Interface
      8. 9.1.8 Bipolar Operation Using the DAC8532
    2. 9.2 Typical Application
      1. 9.2.1 Using REF5050 as a Power Supply for DAC8532
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from A Revision (May 2003) to B Revision

  • Added Device Information and Handling Rating tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from * Revision (December 2001) to A Revision

  • Added text string "No device pin should be brought high before power is applied to the device." to the Power-On Reset Description. Go
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