SLAS429E April   2005  – June 2017 DAC8551

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Typical Characteristics
      1. 6.7.1 VDD = 5 V
      2. 6.7.2 VDD = 2.7 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DAC Section
        1. 7.3.1.1 Resistor String
        2. 7.3.1.2 Output Amplifier
      2. 7.3.2 Power-On Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Input Shift Register
      3. 7.5.3 SYNC Interrupt
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bipolar Operation Using the DAC8551
    2. 8.2 Typical Application
      1. 8.2.1 Loop-Powered, 2-Wire, 4-mA to 20-mA Transmitter With XTR116
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Using the REF02 as a Power Supply for the DAC8551
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 System Examples
      1. 8.3.1 Microprocessor Interfacing
        1. 8.3.1.1 DAC8551 to 8051 Interface
        2. 8.3.1.2 DAC8551 to Microwire Interface
        3. 8.3.1.3 DAC8551 to 68HC11 Interface
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

  • 2-wire, 4-mA to 20-mA Transmitter, EMC/EMI Tested Reference Design, TIDUAO7
  • +5V Precision Voltage Reference, SBVS003
  • CMOS, Rail-to-Rail, I/O Operational Amplifiers, SBOS180

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

SPI, QSPI are trademarks of Motorola, Inc.

Microwire is a trademark of National Semiconductor.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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