ZHCSFZ2 February   2017 DAC8775

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Write and Readback Mode
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Current Output Stage
      2. 8.3.2  Voltage Output Stage
      3. 8.3.3  Buck-Boost Converter
        1. 8.3.3.1 Buck-Boost Converters Outputs
        2. 8.3.3.2 Selecting and Enabling Buck-Boost Converters
        3. 8.3.3.3 Configurable Clamp Feature and Current Output Settling Time
          1. 8.3.3.3.1 Default Mode - CCLP[1:0] = "00" - Current Output Only
          2. 8.3.3.3.2 Fixed Clamp Mode - CCLP[1:0] = "01" - Current and Voltage Output
          3. 8.3.3.3.3 Auto Learn Mode - CCLP[1:0] = "10" - Current Output Only
          4. 8.3.3.3.4 High Side Clamp (HSCLMP)
        4. 8.3.3.4 Buck-Boost Converters and Open Circuit Current Output
      4. 8.3.4  Analog Power Supply
      5. 8.3.5  Digital Power Supply
      6. 8.3.6  Internal Reference
      7. 8.3.7  Power-On-Reset
      8. 8.3.8  ALARM Pin
      9. 8.3.9  Power GOOD Bits
      10. 8.3.10 Status Register
      11. 8.3.11 Status Mask
      12. 8.3.12 Alarm Action
      13. 8.3.13 Watchdog Timer
      14. 8.3.14 Programmable Slew Rate
      15. 8.3.15 HART Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Peripheral Interface (SPI)
        1. 8.4.1.1 Stand-Alone Operation
        2. 8.4.1.2 Daisy-Chain Operation
      2. 8.4.2 SPI Shift Register
      3. 8.4.3 Write Operation
      4. 8.4.4 Read Operation
      5. 8.4.5 Updating the DAC Outputs and LDAC Pin
        1. 8.4.5.1 Asynchronous Mode
        2. 8.4.5.2 Synchronous Mode
      6. 8.4.6 Hardware RESET Pin
      7. 8.4.7 Hardware CLR Pin
      8. 8.4.8 Frame Error Checking
      9. 8.4.9 DAC Data Calibration
        1. 8.4.9.1 DAC Data Gain and Offset Calibration Registers
    5. 8.5 Register Maps
      1. 8.5.1 DAC8775 Commands
      2. 8.5.2 Register Maps and Bit Functions
        1. 8.5.2.1  No Operation Register (address = 0x00) [reset = 0x0000]
        2. 8.5.2.2  Reset Register (address = 0x01) [reset = 0x0000]
        3. 8.5.2.3  Reset Config Register (address = 0x02) [reset = 0x0000]
        4. 8.5.2.4  Select DAC Register (address = 0x03) [reset = 0x0000]
        5. 8.5.2.5  Configuration DAC Register (address = 0x04) [reset = 0x0000]
        6. 8.5.2.6  DAC Data Register (address = 0x05) [reset = 0x0000]
        7. 8.5.2.7  Select Buck-Boost Converter Register (address = 0x06) [reset = 0x0000]
        8. 8.5.2.8  Configuration Buck-Boost Register (address = 0x07) [reset = 0x0000]
        9. 8.5.2.9  DAC Channel Calibration Enable Register (address = 0x08) [reset = 0x0000]
        10. 8.5.2.10 DAC Channel Gain Calibration Register (address = 0x09) [reset = 0x0000]
        11. 8.5.2.11 DAC Channel Offset Calibration Register (address = 0x0A) [reset = 0x0000]
        12. 8.5.2.12 Status Register (address = 0x0B) [reset = 0x1000]
        13. 8.5.2.13 Status Mask Register (address = 0x0C) [reset = 0x0000]
        14. 8.5.2.14 Alarm Action Register (address = 0x0D) [reset = 0x0000]
        15. 8.5.2.15 User Alarm Code Register (address = 0x0E) [reset = 0x0000]
        16. 8.5.2.16 Reserved Register (address = 0x0F) [reset = N/A]
        17. 8.5.2.17 Write Watchdog Timer Register (address = 0x10) [reset = 0x0000]
        18. 8.5.2.18 Device ID Register (address = 0x11) [reset = 0x0000]
        19. 8.5.2.19 Reserved Register (address 0x12 - 0xFF) [reset = N/A]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Buck-Boost Converter External Component Selection
      2. 9.1.2 Voltage and Current Ouputs on a Shared Terminal
      3. 9.1.3 Optimizing Current Output Settling time with Auto learn Mode
      4. 9.1.4 Protection for Industrial Transients
      5. 9.1.5 Implementing HART with DAC8775
    2. 9.2 Typical Application
      1. 9.2.1 1W Power Dissipation, Quad Channel, EMC and EMI Protected Analog Output Module with Adaptive Power Management
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 文档支持

12.1.1 相关文档　

相关文档请参见以下部分：

  • 《DAC8775 EVM 用户指南》（文献编号：SBAU248）
  • 《LM5166 IQ 超低的 3V 至 65V 输入、500mA 同步降压转换器数据表》（文献编号：SNVSA67）
  • 《ISO76x1 低功耗三通道和四通道数字隔离器》（文献编号：SLLSEC3）

12.2 接收文档更新通知

如需接收文档更新通知，请访问 www.yogichopra.com 网站上的器件米6体育平台手机版_好二三四文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定期收到已更改的米6体育平台手机版_好二三四信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。

12.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 商标

Microwire, E2E are trademarks of Texas Instruments.

SPI, QSPI are trademarks of Motorola, Inc.

All other trademarks are the property of their respective owners.

12.5 静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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