ZHCSP43C november   2021  – july 2023 DLP160AP

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Power Density Calculation
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

Micromirror Array Optical Characteristics

PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
Micromirror tilt angle DMD landed state(1) 17 degree
Micromirror tilt angle tolerance(2)(3)(4)(5) –1.4 1.4 degree
Micromirror tilt direction (6)(7) Landed ON state 180 degree
Landed OFF state 270
Micromirror crossover time(8) Typical performance 1 3 µs
Micromirror switching time(9) Typical performance 10
Image performance(10) Bright pixel(s) in active area (11) Gray 10 Screen (12) 0 micromirrors
Bright pixel(s) in the POM (13) Gray 10 Screen (12) 1
Dark pixel(s) in the active area (14) White Screen 4
Adjacent pixel(s) (15) Any Screen 0
Unstable pixel(s) in active area (16) Any Screen 0
Measured relative to the plane formed by the overall micromirror array.
Additional variation exists between the micromirror array and the package datums.
Represents the landed tilt angle variation relative to the nominal landed tilt angle.
Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices.
For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations, system efficiency variations, or system contrast variations.
When the micromirror array is landed (not parked), the tilt direction of each individual micromirror is dictated by the binary contents of the CMOS memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in the ON state direction. A binary value of 0 results in a micromirror landing in the OFF state direction. See Figure 6-17.
Micromirror tilt direction is measured as in a typical polar coordinate system: Measuring counter-clockwise from a 0° reference which is aligned with the +X Cartesian axis.
The time required for a micromirror to nominally transition from one landed state to the opposite landed state.
The minimum time between successive transitions of a micromirror.
Conditions of Acceptance: All DMD image quality returns will be evaluated using the following projected image test conditions:
       Test set degamma shall be linear
       Test set brightness and contrast shall be set to nominal
       The diagonal size of the projected image shall be a minimum of 20 inches
       The projections screen shall be 1X gain
       The projected image shall be inspected from a 38 inch minimum viewing distance
       The image shall be in focus during all image quality tests
Bright pixel definition: A single pixel or mirror that is stuck in the ON position and is visibly brighter than the surrounding pixels
Gray 10 screen definition: All areas of the screen are colored with the following settings:
      Red = 10/255
      Green = 10/255
      Blue = 10/255
POM definition: Rectangular border of off-state mirrors surrounding the active area
Dark pixel definition: A single pixel or mirror that is stuck in the OFF position and is visibly darker than the surrounding pixels
Adjacent pixel definition: Two or more stuck pixels sharing a common border or common point, also referred to as a cluster
Unstable pixel definition: A single pixel or mirror that does not operate in sequence with parameters loaded into memory. The unstable pixel appears to be flickering asynchronously with the image
GUID-20210813-SS0I-NJ2K-6TSS-WKPVPPSB3VCP-low.gif Figure 6-17 Landed Pixel Orientation and Tilt