ZHCSMH3B February   2022  – December 2023 DLP2021-Q1

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 说明（续）
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5.     12
   6. 6.5  Thermal Information
   7. 6.6  Electrical Characteristics
   8. 6.7  Timing Requirements
   9.     16
   10. 6.8  System Mounting Interface Loads
   11.     18
   12. 6.9  Micromirror Array Physical Characteristics
   13.     20
   14.     21
   15. 6.10 Micromirror Array Optical Characteristics
   16. 6.11 Window Characteristics
   17. 6.12 Chipset Component Usage Specification
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
         1. 7.3.6.1 Temperature Sense Diode Theory
   4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
   5. 7.5 DMD Image Performance Specification
   6. 7.6 Micromirror Array Temperature Calculation
   7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
   3. 8.3 Application Mission Profile Consideration
10. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
       1. 9.1.1 Power Up and Power Down
11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
12. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 Device Nomenclature
       2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
       1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 Device Handling
    8. 11.8 术语表
13. 12Revision History
14. 13Mechanical, Packaging, and Orderable Information