米6体育平台手机版

ZHCSMH3B February 2022 – December 2023 DLP2021-Q1

PRODUCTION DATA

1
1 特性
2 应用
3 说明
4 说明（续）
5 Pin Configuration and Functions
6 Specifications
7 Detailed Description
8 Application and Implementation
9 Power Supply Recommendations
1. 9.1 Power Supply Sequencing Requirements
  1. 9.1.1 Power Up and Power Down
10Layout
1. 10.1 Layout Guidelines
2. 10.2 Temperature Diode Pins
11Device and Documentation Support
12Revision History
13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)

FQU|64
- MCLG044B

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcsmh3b_oa
zhcsmh3b_pm

6.9 Micromirror Array Physical Characteristics

PARAMETER			VALUE	UNIT
M	Number of active columns⁽¹⁾		416	micromirrors
N	Number of active rows⁽¹⁾		468	micromirrors
ε	Micromirror Pitch (diagonal)⁽²⁾		7.6	µm
P	Micromirror Pitch (horizontal and vertical)⁽²⁾		10.8	µm
	Micromirror active array width	(P × M) + (P / 2)	4.498	mm
	Micromirror active array height	(P × N) / 2 + (P / 2)	2.533	mm
	Micromirror active border	Pond of micromirrors (POM) ⁽³⁾	10	micromirrors/side

(1) See Array Physical Characteristics.

(2) See Pixel Pitch.

(3) The structure and qualities of the border around the active array include a band of partially functional micromirrors called the POM. These micromirrors are structurally and electrically prevented from tilting toward the bright or ON state, but still require an electrical bias to tilt toward OFF.