ZHCSJL8A April   2019  – September 2019 DLP3034-Q1

PRODUCTION DATA.  

1. 1 特性
2. 2 应用
3. 3 说明
   1.     Device Images
      1.      DLPDLP3034-Q1 系统框图
4. 4 修订历史记录
5. 5 Pin Configuration and Functions
   1.     Pin Configurations and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  Switching Characteristics
   9. 6.9  System Mounting Interface Loads
   10. 6.10 Physical Characteristics of the Micromirror Array
   11. 6.11 Micromirror Array Optical Characteristics
   12. 6.12 Window Characteristics
   13. 6.13 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
         1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
   4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
   5. 7.5 Micromirror Array Temperature Calculation
   6. 7.6 Micromirror Landed-On/Landed-Off Duty Cycle
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
   3. 8.3 Application Mission Profile Consideration
   4. 8.4 Illumination Mission Profile Considerations
9. 9 Power Supply Recommendations
   1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
    3. 10.3 Layout Example
11. 11器件和文档支持
    1. 11.1 器件支持
       1. 11.1.1 器件命名规则
       2. 11.1.2 器件标记
    2. 11.2 文档支持
       1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 器件处理
    8. 11.8 Glossary
12. 12机械、封装和可订购信息