ZHCSJA4B January 2019 – May 2022 DLP4500
PRODUCTION DATA
The DMD is designed to conduct the absorbed and dissipated heat back to the package where it can be removed by an appropriate thermal management system. The thermal management system must be capable of maintaining the package within the specified operational temperatures at the Thermal test point location, see Figure 8-3. The total heat load on the DMD is typically driven by the incident light absorbed by the active area; although other contributions can include light energy absorbed by the window aperture, electrical power dissipation of the array, and/or parasitic heating.