THERMAL METRIC |
DLP4620S-Q1 |
UNIT |
FQX |
Thermal resistance |
Active
area-to-test point 1 (TP1)(1) |
1.3 |
°C/W |
Thermal resistance |
Active
area-to-temperature sense diode(1) |
0.1 |
°C/W |
(1) The DMD is designed to conduct absorbed and dissipated heat to the
back of the package. The cooling system must be capable of maintaining the package
within the temperature range specified in the Recommended Operating
Conditions section. The total heat load on the DMD is largely driven by the
incident light absorbed by the active area, although other contributions include
light energy absorbed by the window aperture and electrical power dissipation of the
array. Design optical systems to minimize the light energy falling outside the
window's clear aperture since any additional thermal load in this area can
significantly degrade the reliability of the device.