(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of maintaining the package within the temperature range specified in the Recommended Operating Conditions section. The total heat load on the DMD is largely driven by the incident light absorbed by the active area, although other contributions include light energy absorbed by the window aperture and electrical power dissipation of the array. Design optical systems to minimize the light energy falling outside the window's clear aperture since any additional thermal load in this area can significantly degrade the reliability of the device.

(2) The thermal resistance values provided here assumes a non-uniform illumination profile. Refer to the Micromirror Array Temperature Calculation section for details.