ZHCSRE5B December   2022  – August 2024 DLP4621-Q1

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  Storage Conditions
   3. 5.3  ESD Ratings
   4. 5.4  Recommended Operating Conditions
      1. 5.4.1 Illumination Overfill Diagram
   5. 5.5  Thermal Information
   6. 5.6  Electrical Characteristics
   7. 5.7  Timing Requirements
      1.      Electrical and Timing Diagrams
   8. 5.8  Switching Characteristics
      1. 5.8.1 LPSDR and Test Load Circuit Diagrams
   9. 5.9  System Mounting Interface Loads
      1.      System Interface Loads Diagram
   10. 5.10 Micromirror Array Physical Characteristics
       1. 5.10.1 Micromirror Array Physical Characteristics Diagram
   11. 5.11 Micromirror Array Optical Characteristics
   12. 5.12 Window Characteristics
   13. 5.13 Chipset Component Usage Specification
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 SubLVDS Data Interface
      2. 6.3.2 Low Speed Interface for Control
      3. 6.3.3 DMD Voltage Supplies
      4. 6.3.4 Asynchronous Reset
      5. 6.3.5 Temperature Sensing Diode
         1. 6.3.5.1 Temperature Sense Diode Theory
   4. 6.4 System Optical Considerations
      1. 6.4.1 Numerical Aperture and Stray Light Control
      2. 6.4.2 Pupil Match
      3. 6.4.3 Illumination Overfill
   5. 6.5 DMD Image Performance Specification
   6. 6.6 Micromirror Array Temperature Calculation
      1. 6.6.1 Monitoring Array Temperature Using the Temperature Sense Diode
   7. 6.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Application
      1. 7.2.1 Application Overview
      2. 7.2.2 Input Image Resolution
      3. 7.2.3 Reference Design
      4. 7.2.4 Application Mission Profile Consideration
   3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Power-Up Procedure
      2. 7.3.2 Power Supply Power-Down Procedure
      3. 7.3.3 Power Supply Sequencing Requirements
   4. 7.4 Layout Guidelines
   5. 7.5 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Device Markings
   2. 8.2 第三方米6体育平台手机版_好二三四免责声明
   3. 8.3 接收文档更新通知
   4. 8.4 支持资源
   5. 8.5 Trademarks
   6. 8.6 静电放电警告
   7. 8.7 DMD Handling
   8. 8.8 术语表
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information